CSD88599Q5DC

MOSFET de alimentación NexFET™ de Texas Instruments

Los MOSFET de alimentación NexFET™ de Texas Instruments ofrecen la mitad de carga de compuerta para la misma resistencia, de forma que los diseñadores pueden obtener una eficiencia de alimentación del 90% con el doble de frecuencia. Los MOSFET de alimentación NexFET de TI combinan un flujo de corriente vertical con un MOSFET de alimentación lateral. Estos dispositivos ofrecen una resistencia de activación baja y requieren una carga de compuerta extremadamente baja con perfiles de paquete habituales en el sector. Esta combinación no era posible anteriormente con las plataformas de silicio existentes. La tecnología del MOSFET de alimentación NexFET de TI mejora la eficacia energética para sistemas informáticos de altas prestaciones, redes, sistemas de redes y fuentes de alimentación.
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Power Block TI NexFET

NexFET Power Block ICs

Texas Instruments NexFET Power Block ICs are optimized driver ICs with Dual NexFET MOSFETs used in the devices. This delivers higher efficiency in a typical high current POL design. These devices use half the PCB area versus other discrete 3x3 QFN package MOSFETs, which improves power density. With ultra-low Qg & Qgd, these devices enable a higher switching frequency with up to double frequency for the same power loss versus competitor's devices. This feature provides improved transient response for fewer output capacitors that will be needed. There is a size reduction, by up to 1/2, for the output filter (caps & inductor). Texas Instruments NexFET Power Block ICs come with a unique ground pad lead frame and pinout, which simplifies the customer's layout and improves operating and thermal performance.

CSD88599Q5DC 60V Half-Bridge NexFET Power Block

Texas Instruments CSD88599Q5DC 60V Half-Bridge NexFET Power Block is an optimized design for high-current motor control applications. These applications include handheld, cordless garden, and power tools. The CSD88599Q5DC utilizes TI’s patented stacked die technology to minimize parasitic inductances while offering a complete half-bridge. The device comes in a space-saving thermally enhanced DualCool™ 5mm × 6mm package. With an exposed metal top, this power block device allows for a simple heat sink application to draw heat out through the top of the package and away from the PCB. This design allows for superior thermal performance at the higher currents demanded by many motor control applications.