1-2007637-8

TE Connectivity
571-1-2007637-8
1-2007637-8

Fabr.:

Descripción:
Conectores de E/S SFP+assy 2x2 Sp Fing No LP EMI Enhanced

Modelo ECAD:
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En existencias: 110

Existencias:
110 Puede enviarse inmediatamente
Plazo de producción de fábrica:
7 Semanas Tiempo estimado para la producción en fábrica para cantidades superiores a las mostradas.
Mínimo: 1   Múltiples: 1
Precio unitario:
-,-- €
Precio total:
-,-- €
Tarifa estimada:

Precio (EUR)

Cant. Precio unitario
Precio total
31,61 € 31,61 €
26,05 € 260,50 €
24,80 € 496,00 €
24,10 € 1.446,00 €
23,25 € 2.325,00 €
23,15 € 6.482,00 €
560 Cotización

Atributo del producto Valor del atributo Seleccionar atributo
TE Connectivity
Categoría de producto: Conectores de E/S
RoHS:  
Cages
Female
80 Position
Gold
Through Hole
Press Fit
Horizontal
SFP+
- 55 C
+ 105 C
Bulk
Marca: TE Connectivity
Color: Black
Material del contacto: Copper Alloy
País de ensamblaje: CN
País de difusión: Not Available
País de origen: CN
Características: Cage assembly with integrated connector, and no light pipes
Inflamabilidad máxima: UL 94 V-0
Material de la carcasa: Liquid Crystal Polymer (LCP)
Número de puertos: 4 Port
Tipo de producto: I/O Connectors
Cantidad del paquete de fábrica: 20
Subcategoría: I/O Connectors
Tipo: SFP+
Peso unitario: 55,080 g
Productos encontrados:
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Atributos seleccionados: 0

TARIC:
8536693000
CNHTS:
8536901100
CAHTS:
8536690020
USHTS:
8536694040
JPHTS:
853669000
KRHTS:
8536691000
MXHTS:
85366999
BRHTS:
85366990
ECCN:
EAR99

TE Connectivity SFP+ I/O

TE Connectivity's SFP+ product family extends the use of the Small Form-Factor Pluggable (SFP) interconnect up to 10Gb/s. This system meets the performance requirements of SFF (Small Form-Factor) specification SFF-8431 and supports 8G Fiber Channel and 10G Ethernet applications. The SFP+ product family includes cages, connectors, and copper cable assemblies.
Learn More

SFP+ Enhanced Connectors

TE Connectivity SFP+ Enhanced Connectors improve thermal performance and EMI containment in applications with demanding bandwidth and data rates. The SFP+ thermal improvements provide an average 3% reduction in temperature, per port, increasing efficiency while requiring less power to operate the overall system. The new enhanced signal quality reduces EMI by approximately 10-12 dBm (within the 10-15 GHz range) due to the internal redesign of the retention and latch plates achieving better electrical connections and product strength while preventing leakage.

SFP+ Family Interconnect System

TE Connectivity SFP+ I/O Interconnects are designed to transfer data at speeds of up to 16Gb/s. The portfolio features 20-position SMT connectors as well as cages in multiple configurations, and with elastomeric gasket or enhanced EMI springs to address EMI containment at higher data rates. TE SFP+ Interconnect family also includes thermal- and EMI-enhanced stacked configurations to further improve performance. Complementary SFP+ direct-attach copper cable assemblies are also offered as high-speed, cost-effective alternatives to fiber optic cables. The assemblies enable hardware OEMs and data center operators to achieve high port density and configurability at low costs and with reduced power requirements.